Solving the Transfer Challenge

for MicroLED Display and Micro Semiconductor Fabrication at Scale

The image shows a sophisticated manufacturing machine designed for semiconductor production, with a microchip layout displayed above it, highlighting its technological capabilities.

MicroSolid Printing™ Versus Laser and Pick and Place

MicroSolid Printing™ cracks the code in the efficient transfer of LEDs from wafer to backplane. With an initial focus on microLED displays, the platform will help enable a $30 billion market by 2030.

The Problem:

Traditional methods like laser and pick-and-place are:
Inefficient
Costly
Unscalable
Environmentally Unfriendly

The Solution:

MicroSolid Printing™: A scalable, eco-friendly turnkey approach that delivers unparalleled results over other transfer methods.
Superior Performance
Exceptional visual quality and energy efficiency
Tunable transparency from 80% to zero
Versatile applications across industries
Unmatched Efficiency
99.999% yield rate
2-5 times higher throughput
Rapid placement of tens of millions of micro-LEDs
Cost-Effective Production
2-5 times more economical
Up to 10x reduction in wafer usage
80% wafer utilization (compared to <50% for other solutions)
MicroSolid Printing™ is paving the way for widespread adoption of microLED display technology and life-changing micro semiconductor products.

Laser Release

The image depicts a layered structure with a transparent top layer featuring pins aligned above a blue base layer with square patterns.

High Selectivity

Yield
Throughput
Performance

Pick & Place (P&P)

The image illustrates a process with numbered steps, showing layers and components in a systematic arrangement, likely related to a technical or engineering procedure.

Simple Tool

Yield
Throughput
Performance

MicroSolid PRINTING™

The image illustrates a two-step process: an offset method for positioning elements, followed by a printing step to finalize the layout.

Scalable • Affordable • Uniform

Yield
Throughput
Performance

MicroSolid Printing™: Unparalleled Results

MicroSolid Printing™ addresses four key obstacles in microLED and micro semiconductor fabrication:
High Yield
  • Achieves rapid transfer of millions of micropixel devices.
  • Delivers near-perfect yield with zero defects.
Unmatched Throughput
  • Efficiently transfers millions of microLED chips.
  • Outperforms traditional methods like laser and pick-and-place.
Superior Performance
  • Overcomes wafer non-uniformity challenges.
  • Achieves >80% wafer utilization (vs. <50% for traditional solutions).
Cost-Effective Integration
  • Seamlessly integrates with existing fabrication processes.
  • Enables transition to microLED or micro semi devices with minimal CApEX.
MicroSolid Printing™ advances both microLED displays and micro semiconductor applications, propelling industry innovation.

Material Cost

The image is a bar graph displaying energy efficiency (KGB/water per display) for three categories: Laser - P & P, Improved LED Pitch, and Improved Wafer Utilization & LED Pitch.
  • 2-5x lower cost
  • Enabling smartphone by meeting the cost and scale

Throughput

The image displays a bar graph comparing the time (arbitrary units) for three methods: Laser, P & P, and VueReal, with Laser exhibiting the highest time.
  • 2x faster using similar tool
  • 6x faster in our roadmap

Uniformity

The image displays a bar graph comparing display uniformity percentages for Laser, P & P, and VueReal, with VueReal showing the highest value.
  • Managing non-uniformity
  • Rendering more wafers useful
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