Solving the Transfer Challenge
for MicroLED Display and Micro Semiconductor Fabrication at Scale
MicroSolid Printing™ Versus Laser and Pick and Place
MicroSolid Printing cracks the code in the efficient transfer of LEDs from wafer to backplane. With an initial focus on microLED displays, the platform will help enable a $30 billion market by 2030.The Problem:
Traditional methods like laser and pick-and-place are:Inefficient
Costly
Unscalable
Environmentally Unfriendly
The Solution:
MicroSolid Printing: A scalable, eco-friendly turnkey approach that delivers unparalleled results over other transfer methods.Superior Performance
Exceptional visual quality and energy efficiency
Tunable transparency from 80% to zero
Versatile applications across industries
Unmatched Efficiency
99.999% yield rate
2-5 times higher throughput
Rapid placement of tens of millions of micro-LEDs
Cost-Effective Production
2-5 times more economical
Up to 10x reduction in wafer usage
80% wafer utilization (compared to <50% for other solutions)
MicroSolid Printing is paving the way for widespread adoption of microLED display technology and life-changing micro semiconductor products.
Laser Release
High Selectivity
Pick & Place (P&P)
Simple Tool
MicroSolid PRINTING™
Scalable • Affordable • Uniform
MicroSolid Printing™: Unparalleled Results
MicroSolid Printing™ addresses four key obstacles in microLED and micro semiconductor fabrication:High Yield
- Achieves rapid transfer of millions of micropixel devices.
- Delivers near-perfect yield with zero defects.
Unmatched Throughput
- Efficiently transfers millions of microLED chips.
- Outperforms traditional methods like laser and pick-and-place.
Superior Performance
- Overcomes wafer non-uniformity challenges.
- Achieves >80% wafer utilization (vs. <50% for traditional solutions).
Cost-Effective Integration
- Seamlessly integrates with existing fabrication processes.
- Enables transition to microLED or micro semi devices with minimal CApEX.
MicroSolid Printing™ advances both microLED displays and micro semiconductor applications, propelling industry innovation.
Material Cost
- 2-5x lower cost
- Enabling smartphone by meeting the cost and scale
Throughput
- 2x faster using similar tool
- 6x faster in our roadmap
Uniformity
- Managing non-uniformity
- Rendering more wafers useful
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