MicroSolid Printing™ Platform

The Gold Standard in Micro Semiconductor Fabrication

Key Components

Supports multiple technologies including MicroLED, sensors, and chiplets.

Pre-inspected and binned for optimal performance.

Compatible with existing foundries for rapid scale-up production.

Enables precise placement of micropixels onto large substrates.

Compatible with larger area substrates.

Supports various bonding technologies such as thermal compression, eutectic, and adhesive.

Comprehensive inspection systems.

Real-time quality control and defect identification.

Cost-effective repair solutions, including dynamic quantum dot patterning.

Fully verified ecosystem deployable in partner/customer facilities, encompassing tools, materials, processes, technologies, and vendors.

Seamlessly integrates with existing manufacturing processes.

Accommodates a wide range of production scales from development and custom production to high-volume consumer market production.

Precise Control of Transparency: Dynamic adjustment of opacity levels in real-time.
Seamless Transitions: Displays can switch between fully transparent, partially transparent, or opaque states.
Enhanced User Interactivity: Pixel-by-pixel transparency control improves display performance.

Dual-Function Design: Provides visual output and energy harvesting
Transparent MicroLEDs: Allow light to reach the solar substrate underneath
Energy Efficiency: Reduces display power consumption while generating electricity
High-Performance: Maintains vibrant, high-resolution imagery

Tailored for Augmented Reality (AR) applications.
Enables full-color displays without compromising performance or power consumption.
Supports additional subpixels (e.g., light blue) for enhanced user eye safety.

MicroSolid Printing™ Benefits